关键词: 系统级封装, 系统级模块, 多芯片模块

Abstract: System in package (SiP) technology has been applied widely for mobile devices, wearables, health and medical devices, artificial intelligence (AI), Internet of Things (IoT), and automotives. SiP deploys heterogeneous integration to group various chips and components in a single package to achieve a specific function, and has advantages such as saving board space, simplifying layout design, and reducing fabrication cost. As the miniaturization of electronic assemblies continues, some SiPs have evolved to be modules, or system in modules (SiMs) that can be connected and fitted directly into a device. The evolution of SiP from multi-chip module (MCM), multi-chip package (MCP) to advanced Chiplet package and the co-packaged optics (CPO) is reviewed. In the coming years, more SiPs will turn into SiMs for direct connection to devices or systems.

Key words: system in package, system in module, multi-chip module