关键词: 封装技术, 大功率芯片, 陶瓷基板, 散热, 有限元仿真, 微流道

Abstract: With the rapid development of microwave components towards high power and high density integration, the heat dissipation problem of high power chips in the components has affected the reliability of the components, and the solution of the heat dissipation problem of high power microwave components requires the use of high-efficiency heat dissipation technology. As one of the emerging fast heat dissipation technologies, microfluidic channel has many advantages such as low thermal resistance, high efficiency and integration. The finite element analysis model of microfluidic channel ceramic substrate based on high power microwave components is established, and the thermal simulation is carried out to analyze the effects of different microfluidic channel configurations, duty cycles, perturbation column radius and flow rates on the heat dissipation of the components. The physical components are prepared based on the simulation results, the measured results of the temperature rise decreases by 60 ℃, thus realizing the fast heat dissipation of ultra high power chip.

Key words: packaging technology, high power chip, ceramic substrate, heat dissipation, finite element simulation, microfluidic channel