关键词: 封装技术, 高温服役, 高温焊接, 装联结构

Abstract: In the fields of aerospace, steel metallurgy and geological exploration, some equipment needs to be used in a high-temperature environment. The tolerable temperature of current common assembly structures is generally lower than 200 ℃, or even lower than 150 ℃, which seriously restricts the electronic process of relevant high-temperature service equipment. In order to explore the feasibility of high-temperature soldering of components, the high-temperature soldering process is deeply analyzed. The results show that the solid-liquid phase line temperatures of lead-based high-temperature solder (SnAg2.5Pb96.5) are higher than 250 ℃, the average tensile force of SnAg2.5Pb96.5 solder joints is 139 N, and the average shear force is 237 N. Compared with common lead-free solder (SAC305), SnAg2.5Pb96.5 has a higher solid-liquid phase line temperature, but its tensile force and shear force are reduced. Compared with the direct soldering process, the solder joints obtained by the preheating soldering process have good wettability, and the ceramic capacitors have no cracks. Therefore, the preheating soldering process is more suitable for high-temperature service components.

Key words: packaging technology, high-temperature service, high-temperature soldering, assembly structure