面向PCB应用的超薄铜箔电镀制备研究进展

doi:10.16257/j.cnki.1681-1070.2025.0084

摘要/Abstract

摘要： 电镀铜箔是PCB的核心材料之一，受到广泛关注。随着现代电子产品朝着多功能化、轻、小、薄方向发展，传统PCB制造技术在精细互连线路加工上已难以满足新的技术标准。采用以超薄铜箔（＜5 μm）为核心材料的改良型半加成法，可以制备线宽/线距更小更窄（≤30 μm/30 μm）的互连电路。如何制备厚度在5 μm以下的高性能超薄铜箔是目前电子制造行业亟待解决的问题。总结了超薄铜箔在PCB中的应用方法，讨论了工艺参数、阴极基材和镀液组成等对铜箔电沉积行为、微观结构和性能的影响。综述了现有电镀法在调控超薄铜箔微观结构和性能方面的策略，并对电镀法制备超薄铜箔的未来发展趋势与研究方向进行了展望。

关键词: 铜互连, 电镀工艺, 超薄铜箔, 微观结构

Abstract: Electroplating copper foil is one of the core materials of PCBs, and has gained significant attention. With the development of modern electronic products in the direction of multifunctionality, lightweight, compactness and thinness, it is difficult for traditional PCB manufacturing technology to meet the new technical standards in the fabrication of fine interconnection lines. Using the modified semi-additive process with ultra-thin copper foil (＜5 μm) as the core material, the interconnect circuits with smaller and narrower line width/spacing (≤30 μm/30 μm) can be prepared. How to prepare high-performance ultra-thin copper foil with a thickness below 5 μm is currently an urgent problem in the electronic manufacturing industry. The application methods of ultra-thin copper foil in PCBs are summarized. The influences of process parameters, cathode substrates, and plating bath compositions on the electrodeposition behavior, microstructure, and properties of copper foil are discussed. The strategies of existing electroplating methods in regulating the microstructure and property of ultra-thin copper foil are reviewed, and the future development trends and research directions for producing ultra-thin copper foil by the electroplating methods are prospected.

Key words: copper interconnection, electroplating process, ultra-thin copper foil, microstructure

中图分类号:

TN305.94

高子泓, 刘志权, 李财富. 面向PCB应用的超薄铜箔电镀制备研究进展[J]. 电子与封装, 2025, 25(5): 050104 .

GAO Zihong, LIU Zhiquan, LI Caifu. Research Progress of Ultra-Thin Copper Foil Electroplating Preparation for PCB Applications[J]. Electronics & Packaging, 2025, 25(5): 050104 .

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