铜-铜键合制备多层陶瓷基板技术研究*

doi:10.16257/j.cnki.1681-1070.2025.0086

电子与封装 ›› 2025, Vol. 25 ›› Issue (5): 050105 . doi: 10.16257/j.cnki.1681-1070.2025.0086

• “面向先进封装应用的铜互连键合技术”专题 • 上一篇下一篇

铜-铜键合制备多层陶瓷基板技术研究^*

雷振宇¹,陈浩¹,翟禹光²,王莎鸥²,陈明祥¹

1. 华中科技大学机械科学与工程学院，武汉 430074；2. 北京无线电测量研究所，北京 100854

收稿日期:2025-01-02 出版日期:2025-06-04 发布日期:2025-02-21
作者简介:雷振宇(1993—)，男，湖北武汉人，博士，主要研究方向为电子封装可靠性、多层陶瓷基板制备技术。

Technical Study on Preparation of Multilayer Ceramic Substrates by Cu-Cu Bonding

LEI Zhenyu¹, CHEN Hao¹, ZHAI Yuguang², WANG Shaou², CHEN Mingxiang¹

1. Schoolof Mechanical Science &Engineering, Huazhong University ofScience and Technology, Wuhan 430074, China;2. Beijing Institute of Radio Measurement, Beijing 100854, China

Received:2025-01-02 Online:2025-06-04 Published:2025-02-21

摘要/Abstract

摘要： 为了提高功率器件封装集成度，通过铜-铜热压键合的方式将直接镀铜(DPC)陶瓷基板进行垂直堆叠制备出一种新型多层陶瓷基板。利用电镀工艺对铜表面进行了处理，并探究了铜-铜热压键合的工艺条件。结果表明，在电流密度为2 A/dm²(ASD)时，可制备出高晶面(111)取向的金属铜，其具有较低的表面粗糙度，有利于铜-铜热压键合。在250 ℃和24 MPa压力下，采用高晶面(111)电镀铜实现高强度键合(强度高达32.34 MPa)，制备出含腔体结构的多层陶瓷基板，并具有较高可靠性。

关键词: 铜-铜键合, 多层陶瓷基板, 直接镀铜陶瓷基板, 可靠性

Abstract: To improve the integration of power device packaging, a new type of multilayer ceramic substrate is prepared by vertically stacking direct copper plated (DPC) ceramic substrates through Cu-Cu hot pressing bonding. The copper surface is treated using electroplating technology, and the process conditions for copper copper hot pressing bonding are explored. The results indicate that at a current density of 2 A/dm² (ASD), high crystal face (111) oriented metallic copper can be prepared with low surface roughness, which is beneficial for Cu-Cu hot press bonding. At 250 ℃ and a pressure of 24 MPa, high-strength bonding (strength up to 32.34 MPa) is achieved by electroplating copper with a high crystal surface (111), and a multilayer ceramic substrate containing a cavity structure is prepared with high reliability.

Key words: Cu-Cu bonding, multilayer ceramic substrate, direct plated copper ceramic substrate, reliability

中图分类号:

TN305.94

雷振宇, 陈浩, 翟禹光, 王莎鸥, 陈明祥. 铜-铜键合制备多层陶瓷基板技术研究^*[J]. 电子与封装, 2025, 25(5): 050105 .

LEI Zhenyu, CHEN Hao, ZHAI Yuguang, WANG Shaou, CHEN Mingxiang. Technical Study on Preparation of Multilayer Ceramic Substrates by Cu-Cu Bonding[J]. Electronics & Packaging, 2025, 25(5): 050105 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

铜-铜键合制备多层陶瓷基板技术研究^*

Technical Study on Preparation of Multilayer Ceramic Substrates by Cu-Cu Bonding

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