中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2025, Vol. 25 ›› Issue (7): 070201 . doi: 10.16257/j.cnki.1681-1070.2025.0153

• 封装、组装与测试 • 上一篇    下一篇

基于试验与仿真的CBGA焊点寿命预测技术*

李杰1,2;曹世博2;余伟1;李泽源1;乔志壮2;刘林杰2;张召富3;刘胜1,3;郭宇铮1,3,4   

  1. 1. 武汉大学动力与机械学院,武汉  430072;2. 中国电子科技集团公司第十三研究所,石家庄  050051;3. 武汉大学工业科学研究院,武汉  430072;4. 武汉大学电气与自动化学院,武汉 430072
  • 收稿日期:2024-12-19 出版日期:2025-08-01 发布日期:2025-08-01
  • 作者简介:李杰(1992—),男,河北定州人,博士研究生,工程师,主要从事电子封装可靠性技术研究及产品开发工作。

CBGA Solder Joint Life Prediction Technology Based on Test and Simulation

LI Jie1,2, CAO Shibo2, YU Wei1, LI Zeyuan1, QIAO Zhizhuang2, LIU Linjie2, ZHANG Zhaofu3, LIU Sheng1,3, GUO Yuzheng1,3,4   

  1. 1. School of Power and Mechanical Engineering,Wuhan University, Wuhan 430072, China; 2. China Electronics Technology GroupCorporation No.13 Research Institute, Shijiazhuang050051, China; 3. TheInstitute of Technological Sciences, WuhanUniversity, Wuhan 430072, China; 4. School of Electrical Engineering and Automation, Wuhan University, Wuhan 430072, China
  • Received:2024-12-19 Online:2025-08-01 Published:2025-08-01

摘要: 陶瓷球栅阵列(CBGA)封装技术以其高密度互连优势在电子封装领域占据着举足轻重的地位,焊点的可靠性是影响器件性能的关键因素。采用有限元法深入探究了焊点在热循环载荷下的寿命预测技术。通过板级温循试验,监控导通电阻以分析焊点的寿命数据。构建了CBGA焊点的有限元模型,并对比分析了仿真与试验数据,确定焊点应变能密度均值增量作为寿命表征因子,进而优化了模型的稳健性。将试验实测数据与仿真结果有机结合,集成到Darveaux寿命模型中,建立了焊点寿命预测方法。研究结果证实,该方法能有效预测CBGA焊点的寿命,为同类封装产品的可靠性设计提供了有力的技术支撑。

关键词: CBGA焊点, 有限元法, 寿命预测, 可靠性分析

Abstract: Ceramic ball grid array (CBGA) packaging technology plays a crucial role in the field of electronic packaging due to its high-density interconnect advantages, and the reliability of solder joints is a key factor affecting device performance. The finite element method is used to investigate the life prediction technology of solder joints under thermal cycling loads. Monitor the on resistance through board level temperature cycling test to analyze the lifes data of solder joints. A finite element model of CBGA solder joints is constructed, and simulation and experimental data are compared and analyzed. The average increment of solder joint strain energy density is determined as the life characterization factor, and the robustness of the model is optimized. The experimental measured data is organically combined with simulation results and integrated into the Darveaux life model, the solder joint life prediction method is established. The research results confirm that this method can effectively predict the life of CBGA solder joints, providing strong technical support for the reliability design of similar packaged products.

Key words: CBGA solder joint, finite element method, life prediction, reliability analysis

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