表面贴装锡基焊点长期贮存可靠性及寿命预测研究

doi:10.16257/j.cnki.1681-1070.2022.0712

电子与封装 ›› 2022, Vol. 22 ›› Issue (7): 070201 . doi: 10.16257/j.cnki.1681-1070.2022.0712

• 封装、组装与测试 • 下一篇

表面贴装锡基焊点长期贮存可靠性及寿命预测研究

张贺¹;冯佳运¹;丛森²;王尚¹;安荣¹;吴朗¹;田艳红¹

1. 哈尔滨工业大学先进焊接与连接国家重点实验室，哈尔滨　150001；2. 中国工程物理研究院电子工程研究所，四川绵阳　621900

收稿日期:2022-01-06 出版日期:2022-07-28 发布日期:2022-03-02
作者简介:张贺（1996—），男，内蒙古通辽人，博士研究生，主要研究方向为电子封装与柔性电子。

Study on Long-Term StorageReliability and Life Prediction of Surface Mounted Tin-Based Solder Joints

ZHANG He¹, FENG Jiayun¹, CONG Sen²,WANG Shang¹, AN Rong¹,WU Lang¹, TIAN Yanhong¹

1.State Key Laboratory of Advanced Weldingand Joining, Harbin Institute ofTechnology, Harbin 150001, China; 2. Institute of Electronic Engineering, China Academy of EngineeringPhysics, Mianyang 621900, China

Received:2022-01-06 Online:2022-07-28 Published:2022-03-02

摘要/Abstract

摘要： 互连焊点的室温贮存寿命预测对于电子产品的可靠应用具有重要的工程意义。采用高温加速贮存试验，对有铅钎料（62Sn36Pb2Ag）表面贴装的电容焊点以及有铅钎料（63Sn37Pb）和无铅钎料（SAC305）混合组装的球栅阵列（BGA）焊点进行了长期贮存寿命预测。利用扫描电子显微镜对在3种温度（367.15 K、393.15 K和423.15 K）下贮存不同时间（1天、4天、9天、16天、25天、36天、49天）金属间化合物（IMC）的微观形貌进行了表征，对IMC的生长动力学进行研究并建立了生长模型。选取IMC的厚度作为关键性能退化参数，依据初始IMC厚度分布为失效密度函数，获得了两种类型焊点的可靠度函数，进而确定两种焊点的特征寿命及中位寿命。

关键词: 表面贴装, 锡基钎料, 长期贮存, 寿命预测, 可靠性

Abstract: Room temperature storage life prediction of interconnected solder joints is of great engineering significance for the reliable application of electronic products. A high temperature accelerated storage test is used to predict the long-term storage life of capacitive solder joints surface-mounted with leaded solder (62Sn36Pb2Ag) and ball grid array (BGA) solder joints assembled with a mixture of leaded solder (63Sn37Pb) and lead-free solder (SAC305). The microstructures of intermetallic compounds (IMCs) stored at three temperatures (367.15 K, 393.15 K and 423.15 K) for different time (1 day, 4 days, 9 days, 16 days, 25 days, 36 days, 49 days) are characterized by scanning electron microscopy. The growth kinetics of IMCs is studied and the growth model is established. The thickness of IMCs is selected as the key performance degradation parameter, the reliability function of the two solder joints is obtained according to the initial thickness distribution of IMCs as failure density function, and then the characteristic life and median life of the two solder joints are determined.

Key words: surface mount, tin-basedsolder, long-term storage, life prediction, reliability

中图分类号:

TN305.94

张贺;冯佳运;丛森;王尚;安荣;吴朗;田艳红. 表面贴装锡基焊点长期贮存可靠性及寿命预测研究[J]. 电子与封装, 2022, 22(7): 070201 .

ZHANG He, FENG Jiayun, CONG Sen,WANG Shang, AN Rong,WU Lang, TIAN Yanhong. Study on Long-Term StorageReliability and Life Prediction of Surface Mounted Tin-Based Solder Joints[J]. Electronics & Packaging, 2022, 22(7): 070201 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

表面贴装锡基焊点长期贮存可靠性及寿命预测研究

Study on Long-Term StorageReliability and Life Prediction of Surface Mounted Tin-Based Solder Joints

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