流体辅助飞秒激光技术在半导体材料微纳加工中的应用与进展

doi:10.16257/j.cnki.1681-1070.2025.0087

摘要/Abstract

摘要： 飞秒激光由于短脉冲、高能量密度特性可在一定程度上实现“冷加工”效果，得到微纳加工领域的广泛关注，然而，“冷加工”效果在不同材料中不尽相同。流体可增强加工中的换热作用、减少热效应，与飞秒激光作用后产生空化气泡促使材料被去除，提升加工效率和质量，因此，流体辅助飞秒激光成为新兴的微纳加工方法。对半导体中常见材料的流体辅助飞秒激光微纳加工过程进行了综述，涵盖了不同辅助流体的实验应用、理论计算和机制机理等方面的研究。流体辅助飞秒激光加工在微纳加工领域具有独特优势，但仍存在一些未解决的问题，如不同流体环境下的具体作用机制、加工参数与材料性能之间的精确关系、加工过程中的热力学模型建立等。

关键词: 飞秒激光加工, 流体辅助, 硬脆材料, 半导体材料, 微纳加工, 加工机理

Abstract: Femtosecond laser, with short pulse, high energy density characteristics, to a certain extent, can achieve the “cold processing” effect, attracting significant attention in the field of micro-nano processing. However, the “cold processing” effect varies across different materials. Fluid can enhance heat transfer during processing, reduce thermal effects, and produce cavitation bubbles with femtosecond laser to promote the removal of materials and improve the processing efficiency and quality. Therefore, fluid-assisted femtosecond laser has become an emerging micro-nano processing method. A review of fluid-assisted femtosecond laser micro-nano-processing of common materials in semiconductors is presented, covering the experimental applications, theoretical calculations and mechanism of different auxiliary fluids. Fluid-assisted femtosecond laser processing has unique advantages in the field of micro-nano-processing, but there are still some unsolved problems, such as the specific mechanism of action in different fluid environments, the precise relationship between processing parameters and material properties, and the establishment of thermodynamic modeling in the processing process.

Key words: femtosecond laser processing, fluid-assisted, hard and brittle materials, semiconductor materials, micro-nano-processing, processing mechanism

中图分类号:

TN249

孙凯霖, 田志强, 杨德坤, 赵鹤然, 黄煜华, 王诗兆. 流体辅助飞秒激光技术在半导体材料微纳加工中的应用与进展[J]. 电子与封装, 2025, 25(8): 080403 .

SUN Kailin, TIAN Zhiqiang, YANG Dekun, ZHAO Heran, HUANG Yuhua, WANG Shizhao. Application and Progress of Fluid-Assisted Femtosecond Laser Technology in Micro-Nano-Processing of Semiconductor Materials[J]. Electronics & Packaging, 2025, 25(8): 080403 .

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