关键词: 塑料封装, 多型腔, 金线偏移, 仿真计算

Abstract: Plastic encapsulation is one of the core processes in integrated circuit manufacturing. For plastic encapsulation of smart cards, multi-cavity transfer molding is commonly adopted under the constraints of device thinning and cost reduction. During the transfer molding process, the complex rheological and curing behaviors of molten epoxy molding compounds can easily induce gold wire sweep, thereby compromising the stability and reliability of gold wire interconnections. Focusing on gold wire sweep in thin multi-cavity molding, a model incorporating complete runners and multiple cavities is developed. By combining single-factor analysis with orthogonal experimental design, the influences of mold temperature, transfer pressure, and filling time on gold wire sweep behavior under high cavity-number conditions are examined. The results indicate that in the 0.33 mm multi-cavity smart card package, gold wire sweep varies with cavity location and is highly sensitive to filling time and mold temperature, while exhibiting relatively low sensitivity to transfer pressure. The results provide useful guidance for the optimization of transfer molding process parameters for thin smart card packages.

Key words: plastic encapsulation, multi-cavity, gold wire sweep, simulation