高低温环境下多层片式陶瓷电容器板弯失效分析*

doi:10.16257/j.cnki.1681-1070.2026.0070

电子与封装 ›› 2026, Vol. 26 ›› Issue (3): 030002 . doi: 10.16257/j.cnki.1681-1070.2026.0070

• “电子封装力学仿真方法进展及应用”专题 • 上一篇下一篇

高低温环境下多层片式陶瓷电容器板弯失效分析^*

孙佳琛¹，杨森¹，徐琴^1,2，沈飞¹，柯燎亮¹

1. 天津大学机械工程学院，天津 300350；2. 成都宏科电子科技有限公司，成都 610100

收稿日期:2025-11-20 出版日期:2026-04-02 发布日期:2026-01-05
作者简介:孙佳琛（2002—），男，河北唐山人，硕士研究生，主要研究方向为电子元器件可靠性。

Flexural Failure Analysis of Multilayer Ceramic Capacitors Under High and Low Temperature Conditions

SUN Jiachen¹, YANG Sen¹, XU Qin^1,2, SHEN Fei¹, KE Liaoliang¹

1. Schoolof Mechanical Engineering, Tianjin University, Tianjin 300350, China; 2. Chengdu HongkeElectronic Technology Co., Ltd., Chengdu 610100, China

Received:2025-11-20 Online:2026-04-02 Published:2026-01-05

摘要/Abstract

摘要： 多层片式陶瓷电容器（MLCC）是目前应用最为广泛的无源器件之一。当印制电路板过度弯曲时，MLCC中的脆性陶瓷介质会发生开裂，裂纹穿透内电极导致器件短路。针对这一失效现象，基于Surface Evolver软件准确生成了焊料的几何形态，并采用复合材料均匀化方法对MLCC有源区进行了等效简化，构建了三维热-力耦合有限元模型，计算了3种型号MLCC在5个温度条件（−25、0、25 、50、80 ℃）下的弯曲应力分布。此外，开展了高低温环境下板弯原位试验，试验结果与有限元结果在失效应变值和裂纹起始位置上均具有良好的一致性，验证了有限元模型的准确性。研究结果表明，相较于高温，低温条件下MLCC更容易发生开裂，具有更小的弯曲失效应变。

关键词: 多层片式陶瓷电容器, 板弯失效, 高低温环境, 开裂失效

Abstract: Multilayer ceramic capacitors (MLCCs) are currently among the most widely used passive components. Excessive bending of printed circuit boards can cause fracture of the brittle ceramic dielectric within MLCCs, where crack propagation through the internal electrodes may result in electrical short circuits. To investigate this failure phenomenon, the solder geometries are accurately generated using Surface Evolver and the active region of the MLCC is simplified using a composite material homogenization method. A three-dimensional thermo-mechanical coupled finite element model (FEM) is developed to simulate the bending stress distribution of three types of MLCCs under five temperature conditions (−25, 0, 25, 50, 80 ℃). In addition, bending experiments under high and low temperature conditions are conducted. The experimental results show good agreement with the FEM predictions in terms of both failure strain and crack initiation locations, validating the accuracy of the FEM. The study result indicates that, compared with high temperature conditions, MLCCs are more prone to cracking at low temperatures and exhibit smaller bending failure strains.

Key words: multilayer ceramic capacitor, flexural failure, high and low temperature conditions, crack failure

中图分类号:

TN609

孙佳琛, 杨森, 徐琴, 沈飞, 柯燎亮. 高低温环境下多层片式陶瓷电容器板弯失效分析^*[J]. 电子与封装, 2026, 26(3): 030002 .

SUN Jiachen, YANG Sen, XU Qin, SHEN Fei, KE Liaoliang. Flexural Failure Analysis of Multilayer Ceramic Capacitors Under High and Low Temperature Conditions[J]. Electronics & Packaging, 2026, 26(3): 030002 .

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高低温环境下多层片式陶瓷电容器板弯失效分析^*

Flexural Failure Analysis of Multilayer Ceramic Capacitors Under High and Low Temperature Conditions

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