中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2019, Vol. 19 ›› Issue (4): 010 -14. doi: 10.16257/j.cnki.1681-1070.2019.0038

• 封装、组装与测试 • 上一篇    下一篇

SOP8分层探究及解决

李 进,朱 浩   

  1. 长兴电子材料有限公司,江苏 昆山 215301
  • 收稿日期:2018-11-22 出版日期:2019-04-20 发布日期:2020-01-16
  • 作者简介:李 进(1982—),男,江苏常州人,硕士研究生学历,就职于长兴电子材料(昆山)有限公司,主要从事环氧塑封料(EMC)的相关工作。

SOP8 Delamination Exploration and Solution

LI Jin, ZHU Hao   

  1. Eternal Electronic Materials Co., Ltd., Kunshan 215301, China
  • Received:2018-11-22 Online:2019-04-20 Published:2020-01-16

摘要: 塑料封装作为一种非气密性封装,分层一直是制约其可靠性的一个关键因素,也是可靠性需解决的难点之一。选择确立较为稳定、成熟的引线框架塑料封装制程,研发一款抗分层表现良好的SOP8,搭配优选过的环氧模塑料(EMC),使塑料封装的可靠性大大提升,也促进了EMC在塑料封装中的应用和表现。

关键词: 塑料封装;分层;可靠性

Abstract: As a kind of non-airtight package, delamination has always been a key factor restricting its reliability and one of the difficulties to be solved. Choose to establish a stable and mature plastic packaging process of lead frame, develop a SOP8 with good performance of anti-delamination, and match optimal EMC, so that the reliability of plastic packaging is greatly improved, and is bound to boost EMC packaging in the plastic packaging has a better performance.

Key words: plastic package; delamination; reliability

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