塑封半导体器件耐湿热可靠性研究方法及进展*

doi:10.16257/j.cnki.1681-1070.2026.0080

摘要/Abstract

摘要： 塑封半导体器件在高温高湿环境下的可靠性是其长期稳定运行的关键因素之一。环氧塑封料（EMC）聚合物基体的吸湿性可降低器件内部界面的强度，从而引发腐蚀；同时，较高的湿热应力增加了界面分层失效、器件翘曲等风险。综述国内外关于塑封半导体器件耐湿热可靠性的研究进展，包括湿热失效机理、湿扩散理论、湿热可靠性实验、仿真方法及常用表征技术等，并从材料的选择与改性、结构设计及封装工艺3方面总结塑封半导体器件湿热可靠性的优化策略和改善途径，为塑封半导体器件在湿热环境下的可靠性设计和评估提供参考与方法指导。

关键词: 塑封半导体器件, 湿热可靠性, 失效机理, 湿扩散, 湿热应力

Abstract: The reliability of plastic-encapsulated semiconductor devices under high-temperature and high-humidity conditions is one of the critical factors for ensuring their long-term stable operation. The moisture-absorption characteristics of the polymer matrix of epoxy molding compounds (EMC) can reduce the strength of internal interfaces in the devices, thereby leading to corrosion. Meanwhile, the risks of interfacial delamination failure, device warpage and other failures are increased by elevated hygrothermal stress. Domestic and international research advances in the hygrothermal reliability of plastic-encapsulated semiconductor devices are reviewed, including hygrothermal failure mechanisms, moisture diffusion theory, hygrothermal reliability experiments, simulation methods and commonly used characterization techniques. Optimization strategies and improvement approaches for the hygrothermal reliability of plastic-encapsulated semiconductor devices are summarized from three aspects, material selection and modification, structural design, and packaging processes, so as to provide reference and methodological guidance for reliability design and evaluation of the devices in hygrothermal environments.

Key words: plastic-encapsulated semiconductor device, hygrothermal reliability, failure mechanism, moisture diffusion, hygrothermal stress

中图分类号:

TN306

马立凡, 胡妍妍, 王珺. 塑封半导体器件耐湿热可靠性研究方法及进展^*[J]. 电子与封装, 2026, 26(3): 030004 .

MA Lifan, HU Yanyan, WANG Jun. Methods and Advances in Hygrothermal Reliability of Plastic-Encapsulated Semiconductor Devices[J]. Electronics & Packaging, 2026, 26(3): 030004 .

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中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

塑封半导体器件耐湿热可靠性研究方法及进展^*

Methods and Advances in Hygrothermal Reliability of Plastic-Encapsulated Semiconductor Devices

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