关键词: 塑封半导体器件, 湿热可靠性, 失效机理, 湿扩散, 湿热应力

Abstract: The reliability of plastic-encapsulated semiconductor devices under high-temperature and high-humidity conditions poses one of the critical challenges for the long-term stable operation. Owing to the moisture-absorbing characteristics of the crosslinked polymer network of epoxy molding compounds, moisture uptake can reduce interfacial strength and facilitate corrosion, thereby increasing the risk of delamination, warpage and other failures under hygrothermal loading. This paper reviews recent advances in the study of hygrothermal reliability of plastic-encapsulated devices, including hygrothermal failure mechanisms, moisture diffusion theory, hygrothermal reliability experiments, simulation methodologies, and commonly used characterization techniques. Optimization strategies for improving the hygrothermal reliability of plastic-encapsulated devices are discussed in terms of material modification, structural design, and packaging processes, providing methodological guidance for reliability design and evaluation in hygrothermal environments.

Key words: plastic-encapsulated semiconductor devices, Hygrothermal reliability, Failure mechanisms, moisture diffusion, hygrothermal stress