关键词: 陶瓷封装, 键合线, 机械冲击, 短路

Abstract: High-reliability integrated circuits commonly use ceramic package.However,the internal air-sealed structure of ceramic package circuit is liable to cause the bonding wire short-circuit with adjacent bonding wire when suffering externalmechanical shock.Therefore,during the designing,selection of the bonding line,wiring layout design,optimization of bonding process parameters and the package resistance to external stress are particularly important.In the paper,based on the combination of high-speed camera and electrical detection method,an improved type of short circuit detection method is proposed.The method is based on real-time detection of all measured CQFP228 FPGA circuit ports.The test results show that the method greatly improves the accuracy ofdetection and evaluation,and reduces the detection steps.

Key words: ceramic package, bonding wire, mechanicalshock, shortcircuit