关键词: 低温共烧陶瓷, 微流道, 热-流耦合仿真

Abstract: It is briefly introduced that the fabricating micro-channel structure in LTCC (low temperature co-fired ceramic) substrate is necessary for circuit heat dissipation. Three finite element models of micro-channel with different structures are established and thermal-fluid coupling simulations are performed on them. Then It is analyzed in this article that the influence of different structures, fluid flow rates and inlet and outlet cross-sections on the heat dissipation performance, and prepare real objects based on the simulation results. The actual measurement results show that the maximum temperature rises by 124.3 K at a heat flux density of 14 W/cm², and rises by 71.1 K when the water flow velocity is set to 0.012 m/s ,which are basically consistent with the simulation results.The heat dissipation effect is significant.

Key words: LTCC, micro-channel, thermal-fluidcouplingsimulation