中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
基于非牛顿流体的AuSn20密封空洞分析*
赵鹤然, 李俐莹, 陈明祥
Analysis of Flow Characteristics of Gold-Tin SealingSolder Based on Non-Newtonian Fluid Mechanics
ZHAO Heran, LI Liying, CHEN Mingxiang
电子与封装 . 2021, (12): 120101 .  DOI: 10.16257/j.cnki.1681-1070.2021.1210