基于热测试芯片的2.5D封装热阻测试技术研究
吕晓瑞;刘建松;黄颖卓;林鹏荣
Research on Thermal Resistance Testing Technologyof 2.5D Package Based on Thermal Test Chip
LYU Xiaorui, LIU Jiansong, HUANG Yingzhuo, LIN Pengrong
电子与封装
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2023, (4): 40202
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DOI: 10.16257/j.cnki.1681-1070.2023.0029
