射频组件用键合金带的研究进展*
谢勇,肖雨辰,唐会毅,王云春,侯兴哲,吴华,吴保安,谭生,孙玲
Research Progress of Bonding Au Ribbon for Radio Frequency Components
XIE Yong, XIAO Yuchen, TANG Huiyi, WANG Yunchun, HOU Xingzhe, WU Hua, WU Baoan, TAN Sheng, SUN Ling
电子与封装
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2024, (5): 50201
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DOI: 10.16257/j.cnki.1681-1070.2024.0056
