嵌入合金框架的扇出型板级封装结构及其翘曲仿真分析*
余胜涛,笪贤豪,何伟伟,彭琳峰,王文哲,杨冠南,崔成强
Fan-Out Panel-Level Packaging Structure with Embedded Alloy Frame and Its Warpage Simulation Analysis
YU Shengtao, DA Xianhao, HE Weiwei, PENG Linfeng, WANG Wenzhe, YANG Guannan, CUI Chengqiang
电子与封装
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2024, (11): 110201
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DOI: 10.16257/j.cnki.1681-1070.2024.0156