中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
嵌入合金框架的扇出型板级封装结构及其翘曲仿真分析*
余胜涛,笪贤豪,何伟伟,彭琳峰,王文哲,杨冠南,崔成强
Fan-Out Panel-Level Packaging Structure with Embedded Alloy Frame and Its Warpage Simulation Analysis
YU Shengtao, DA Xianhao, HE Weiwei, PENG Linfeng, WANG Wenzhe, YANG Guannan, CUI Chengqiang
电子与封装 . 2024, (11): 110201 .  DOI: 10.16257/j.cnki.1681-1070.2024.0156