基于SVR数据驱动模型的SiC功率器件关键互连结构热疲劳寿命预测研究*
于鹏举, 代岩伟, 秦飞
Research on Thermal Fatigue Life Prediction of Key Interconnect Structures of SiC Power Devices Based on SVR Data-Driven Model
YU Pengju, DAI Yanwei, QIN Fei
电子与封装
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2024, (12): 120201
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DOI: 10.16257/j.cnki.1681-1070.2024.0162