基于田口法的高热可靠性DFN封装最优结构参数仿真研究*
庞瑞阳,吴洁,王磊,邢卫兵,蔡志匡
Simulation Study on Optimal Structural Parameters of High Thermal Reliability DFN Package Based on Taguchi Method
PANG Ruiyang, WU Jie, WANG lei, XING Weibing, CAI Zhikuang
电子与封装
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2024, (12): 120203
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DOI: 10.16257/j.cnki.1681-1070.2024.0171
