微纳铜材料的制备及其在封装互连中的应用*
彭琳峰，杨凯，余胜涛，刘涛，谢伟良，杨世洪，张昱，崔成强
Preparation of Micro-Nano Copper Material and Its Applications in Package Interconnection
PENG Linfeng, YANG Kai, YU Shengtao, LIU Tao, XIE Weiliang, YANG Shihong, ZHANG Yu, CUI Chengqiang
电子与封装
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2025, (1): 10202
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DOI: 10.16257/j.cnki.1681-1070.2025.0008
