先进电子封装用焊锡球关键尺寸检测研究
李赵龙, 王同举, 刘亚浩, 张文倩, 雷永平
Research on Critical Dimensional Inspection of Solder
Balls for Advanced Electronic Packing
LI Zhaolong, WANG Tongju, LIU Yahao, ZHANG Wenqian, LEI Yongping
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2025.0055
