功率模块封装用环氧树脂改性技术的应用进展
曹凤雷, 贾强, 王乙舒, 刘若晨, 郭褔,
Progress in the Application of Epoxy Resin Modification Technology for Power Module Packaging
CAO Fenglei, JIA Qiang, , WANG Yishu, LIU Ruochen, GUO Fu,
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2025.0056
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