基于纳米铜膏的导电结构激光并行扫描烧结成型技术*
王文哲，李权震，余胜涛，笪贤豪，何伟伟，杨冠南，崔成强
Laser Parallel Scanning Sintering Forming Technology for Conductive Structures Based on Nano Copper Paste
WANG Wenzhe, LI Quanzhen, YU Shengtao, DA Xianhao, HE Weiwei, YANG Guannan, CUI Chengqiang
电子与封装
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2025, (1): 10402
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DOI: 10.16257/j.cnki.1681-1070.2025.0016
