高功率电子封装中大面积烧结技术研究进展<sup>*</sup>

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边乐陶,刘文婷,刘盼

Research Progress on Large-Area Sintering Technology for High-Power Electronic Packaging

BIAN Letao, LIU Wenting, LIU Pan

电子与封装 . 2025, (3): 30108 . DOI: 10.16257/j.cnki.1681-1070.2025.0082