表面贴装大功率器件热匹配问题可靠性仿真<sup>*</sup>

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胡运涛,苏昱太,刘灿宇,刘长清

Reliability Simulation of Thermal Matching Issues in Surface-Mounted High-Power Devices

HU Yuntao, SU Yutai, LIU Canyu,LIU Changqing

电子与封装 . 2025, (3): 30109 . DOI: 10.16257/j.cnki.1681-1070.2025.0083