铜线键合模式和塑封料对QFN封装可靠性的影响

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王宝帅,高瑞婷,张铃,梁栋,欧阳毅

Effect of Wire Bonding Modes and Molding Compounds on QFN Package Reliability

WANG Baoshuai, GAO Ruiting, ZHANG Ling, LIANG Dong, OUYANG Yi

电子与封装 . 2025, (2): 20204 . DOI: 10.16257/j.cnki.1681-1070.2025.0025