功率器件封装用纳米铜焊膏及其烧结技术研究进展*
王秀琦,李一凡,罗子康,陆大世,计红军
Progress of Research on Nano Copper Solder Paste and Its Sintering Technology for Power Device Packaging
WANG Xiuqi, LI Yifan, LUO Zikang, LU Dashi, JI Hongjun
电子与封装
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2025, (3): 30101
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DOI: 10.16257/j.cnki.1681-1070.2025.0046
