基于SiP应用的多层有机复合基板的三维堆叠
姚剑平，李庆东，管慧娟，杨先国，苟明艺
Three-Dimensional Stacking of Multilayer Organic Composite Substrates Based on SiP Applications
YAO Jianping, LI Qingdong, GUAN Huijuan,YANG Xianguo,GOU Mingyi
电子与封装
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2025, (4): 40208
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DOI: 10.16257/j.cnki.1681-1070.2025.0044
