中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
应力缓冲层对玻璃基板填孔结构内应力及可靠性的调控规律研究*
王展博,张泽玺,杨斌,郭旭,杨冠南,张昱,黄光汉,崔成强
Regulation Study of Stress Buffer Layer on the Internal Stress and Reliability of Glass Substrate Hole-Filling Structures
WANG Zhanbo, ZHANG Zexi, YANG Bin, GUO Xu, YANG Guannan, ZHANG Yu, HUANG Guanghan, CUI Chengqiang
电子与封装 . 2025, (7): 70103 .  DOI: 10.16257/j.cnki.1681-1070.2025.0122