玻璃通孔技术及其可靠性研究现状*
马丙戌，王浩中，钟祥祥，向峻杉，刘沛江，周斌，杨晓锋
Research Status of Through Glass Via Technology and Its Reliability
MA Bingxu，WANG Haozhong, ZHONG Xiangxiang, XIANG Junshan, LIU Peijiang, ZHOU Bin, YANG Xiaofeng
电子与封装
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2025, (7): 70106
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DOI: 10.16257/j.cnki.1681-1070.2025.0157
