降低玻璃基板TGV应力的无机缓冲层方法与仿真分析*
赵泉露，赵静毅，丁善军，王启东，陈钏，于中尧
Method and Simulation Analysis of Inorganic Buffer Layer for Reducing TGV Stress in Glass Substrate
ZHAO Quanlu, ZHAO Jingyi, DING Shanjun, WANG Qidong, CHEN Chuan, YU Zhongyao
电子与封装
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2025, (7): 70108
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DOI: 10.16257/j.cnki.1681-1070.2025.0159
