基于试验与仿真的CBGA焊点寿命预测技术*
李杰，曹世博，余伟，李泽源，乔志壮，刘林杰，张召富，刘胜，郭宇铮
CBGA Solder Joint Life Prediction Technology Based on Test and Simulation
LI Jie, CAO Shibo, YU Wei, LI Zeyuan, QIAO Zhizhuang, LIU Linjie, ZHANG Zhaofu, LIU Sheng, GUO Yuzheng
电子与封装
.
2025, (7): 70201
.
DOI: 10.16257/j.cnki.1681-1070.2025.0153
