中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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基于MLP-LSTM机器学习模型的烧结纳米银高温老化力学性能快速反演与预测
赵利波,代岩伟,秦飞
Rapid Inversion and Prediction of High-Temperature Aging Mechanical Properties of Sintered Nanosilver Based on MLP-LSTM Machine Learning Models
电子与封装 . 2025, (9): 90601 .  DOI: 10.16257/j.cnki.1681-1070.2025.0170