热循环载荷下BTC器件焊点应力分析与优化

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吴松, 张可, 梁威威, 谢颖

Stress analysis and optimization of solder joints of BTC devices under thermal cyclic loading

WU Song, ZHANG Ke, LIANG Weiwei, XIE Ying

电子与封装 . 0, (): 0 -0 . DOI: 10.16257/j.cnki.1681-1070.2026.0036