高低温环境下多层瓷介电容器板弯失效分析
孙佳琛1, 杨森1, 徐琴1, 2, 沈飞1, 柯燎亮1
Flexural Failure Analysis of Multilayer Ceramic Capacitors Under High and Low Temperature Conditions
SUN Jiachen1, YANG Sen1, XU Qin1, 2, SHEN Fei1, KE Liaoliang1
电子与封装
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0, (): 0
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DOI: 10.16257/j.cnki.1681-1070.2026.0070
