CSOP焊点形态对热疲劳寿命的影响与优化
郭智鹏1, 2, 张少华2, 李冰晨2, 何文多2
Effect of CSOP Solder Joint Morphology on
Thermal Fatigue Life and Its Optimization
GUO Zhipeng1, 2, ZHANG Shaohua2, LI Bingchen2, HE Wenduo2
电子与封装
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0, (): 0
-0
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DOI: 10.16257/j.cnki.1681-1070.2026.0068
