混合键合界面力学行为的多尺度仿真：研究进展与挑战
蔡新添1, 2, 3, 舒朝玺4, 习杨4, 5, 东芳4, 张适5, 严晗6, 刘胜4, 彭庆5, 7
Multiscale Simulation of Mechanical Behavior at Hybrid Bonding
Interfaces: Advances and Challenges
CAI Xintian1, 2, 3, SHU Chaoxi4, XI Yang4, 5, ZHANG Shi5, DONG Fang4, YAN Han6, LIU Sheng4, PENG Qing5, 7
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0097
