微/纳米铜焊膏制备及其无压裸铜键合研究
郑庆华1, 周炜1, 夏志东1, 刘雁鹏1, 郭福1, 2
Fabircation of Cu Micro-Nano Mixed Particles Solder Paste and Its Pressureless Bare Cu Bonding Investigation
ZHENG Qinghua1, ZHOU Wei1, XIA Zhidong1, LIU Yanpeng1, GUO Fu1, 2
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0122
