基于脉冲反向电镀与添加剂协同调控的高深宽比玻璃通孔填孔工艺研究
谷玉坤1, 柳运游2, 施齐利2, 杨静璇1, 陈文毅1, 洪华1, 张中3, 张国栋3, 史泰龙1
Study on the Filling Process of High Aspect
Ratio Through Glass Via Based on the Synergistic Regulation of Pulse Reverse
Electroplating and Additives
GU Yukun1, LIU Yunyou2, SHI Qili2, YANG Jingxuan1, CHEN Wenyi1, HONG Hua1, ZHANG Zhong3, ZHANG Guodong3, SHI Tailong1
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0127
