纳米银颗粒的可控制备及微纳米银焊膏的烧结连接研究
刘雁鹏1, 夏志东1, 周炜1, 郑庆华1, 郭福1, 2
Controllable Preparation of Ag Nanoparticles and Sintering of Ag Microparticles/Nanoparticles Mixed Solder Paste
LIU Yanpeng1, XIA Zhidong1, ZHOU Wei1, ZHENG Qinghua1, GUO Fu1, 2
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0135
