面向异质异构集成的表面活化室温键合研究进展
安佰涛, 李均铭, 邵耳尼, 马岩, 白玉斐, 牛帆帆, 王晨曦
Advances in Surface
Activated Room Temperature Bonding for Heterogeneous Integration
AN Baitao, LI Junming, SHAO Erni, MA Yan, BAI Yufei, NIU Fanfan, WANG Chenxi
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0142
