电子封装用超薄玻璃基板切割方法研究进展
龚琪1, 郑众2, 方洲1, 林绍1, 杨斌3, 向静2, 解来勇2, 崔成强3, 史训清1, 2
Research Progress on Cutting Methods for Ultra-Thin
Glass Substrates in Advanced Packaging
GONG Qi1, ZHENG Zhong2, FANG Zhou1, LIN Shao1, YANG Bin3, XIANG Jing2, XIE Laiyong2, CUI Chengqiang3, SHI Xunqing1, 2
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0145
