玻璃基先进封装关键电镀工艺及其电镀质量控制综述
贾照伟1, 2, 王其强2, 吴勐2, 李宁2, 马盛林3, 于大全4, 5
Review of Key Electroplating Processes and Electroplating Quality Control for Glass-Based Advanced Packaging
JIA Zhaowei1, 2, WANG Qiqiang2, WU Meng2, LI Ning2, MA Shenglin3, YU Daquan4, 5
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0149
