升温载荷下玻璃通孔异质界面热机械可靠性评估及寿命预测
陈雨1, 丁笑越2, 李照天2, 梁康2, 杨晓锋3, 武晓娟4, 陈义强3, 车春城4, 刘胜1, 2, 张召富2
Thermo-Mechanical Reliability Assessment and Life Prediction of Through-Glass Via Heterogeneous Interfaces under Temperature Ramp Loading
CHEN Yu1, DING Xiaoyue2, LI Zhaotian2, LIANG Kang2, YANG Xiaofeng3, WU Xiaojuan4, CHEN Yiqiang3, CHE Chuncheng4, LIU Sheng1, 2, ZHANG Zhaofu2
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0150
