安装方位对CQFP封装大芯片焊点热疲劳寿命影响的试验研究
赵帅峰, 崔启明, 张琪, 白翌帆, 吴浩
Experimental Study on the Effect of Mounting
Orientation on Thermal Fatigue Life of Solder Joints for Large Die Chips in
CQFP Package
ZHAO Shuaifeng, CUI Qiming, ZHANG Qi, BAI Yifan, WU Hao
电子与封装
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0, (): 0
-0
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DOI: 10.16257/j.cnki.1681-1070.2027.0033
