激光喷球键合BGA焊点组织及显微硬度的尺寸效应
刘笛, 白天越, 乔媛媛, 董伟, 赵宁
Size Effect on Microstructure and Microhardness of Laser
Jet Solder Ball Bonding BGA Joints
LIU Di, BAI Tianyue, QIAO Yuanyuan, DONG Wei, ZHAO Ning
电子与封装
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0, (): 0
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DOI: 10.16257/j.cnki.1681-1070.2027.0037
