基于封装应力和器件传感的三维堆叠存储器温度传感偏差分析及优化
朱文杰, 冯奋泽, 纪志罡, 陈海宝
Analysis and Optimization of Temperature Sensor
Deviations in Three-Dimensional Stacked Memories Based on Package-Stress and
Device-Sensing Mechanisms
ZHU Wenjie, FENG Fenze, JI Zhigang, CHEN Haibao
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0159
