超声功率对25 μm铂金丝球形键合强度的影响及键合点质量评价
赵振力, 孙闻
Effect of Ultrasound Power on the Strength of 25 μm Platinum Wire Spherical Bonding Process and Quality Evaluation of Bonding Point
ZHAO Zhenli, SUN Wen
电子与封装
.
2019, (11): 4
-5
.
DOI: 10.16257/j.cnki.1681-1070.2019.1102
